BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) announced its earnings results on Thursday. The technology company reported $1.29 earnings per share for the quarter, missing analysts’ consensus estimates of $1.30 by ($0.01), Zacks reports. BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%.
BE Semiconductor Industries Stock Down 4.5%
BE Semiconductor Industries stock traded down $12.81 during mid-day trading on Thursday, reaching $270.99. The stock had a trading volume of 420 shares, compared to its average volume of 7,741. The company has a market capitalization of $19.65 billion, a price-to-earnings ratio of 122.62 and a beta of 1.97. The company has a 50-day moving average price of $316.28 and a two-hundred day moving average price of $257.29. BE Semiconductor Industries has a one year low of $122.81 and a one year high of $374.33. The company has a debt-to-equity ratio of 1.11, a current ratio of 4.74 and a quick ratio of 4.17.
Analyst Upgrades and Downgrades
Several research analysts recently issued reports on BESIY shares. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, May 19th. Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of BE Semiconductor Industries in a report on Friday, May 15th. Finally, Zacks Research downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, June 26th. Five equities research analysts have rated the stock with a Buy rating and four have issued a Hold rating to the company. Based on data from MarketBeat.com, BE Semiconductor Industries presently has a consensus rating of “Moderate Buy”.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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