BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) dropped 8.2% on Wednesday. The company traded as low as $193.6610 and last traded at $197.0464. 1,111 shares traded hands during trading, a decline of 88% from the average session volume of 8,994 shares. The stock had previously closed at $214.76.
Wall Street Analysts Forecast Growth
A number of analysts recently commented on the stock. Berenberg Bank upgraded shares of BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a research report on Tuesday, August 4th. Zacks Research downgraded BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, September 25th. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday, September 8th. Finally, UBS Group cut BE Semiconductor Industries from a “buy” rating to a “sell” rating in a report on Wednesday. One investment analyst has rated the stock with a Strong Buy rating, four have issued a Buy rating, three have issued a Hold rating and one has given a Sell rating to the company. According to data from MarketBeat.com, BE Semiconductor Industries has an average rating of “Moderate Buy”.
Read Our Latest Research Report on BESIY
BE Semiconductor Industries Stock Up 0.1%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last announced its earnings results on Thursday, July 23rd. The technology company reported $1.29 EPS for the quarter, missing the consensus estimate of $1.30 by ($0.01). The business had revenue of $290.52 million for the quarter, compared to analyst estimates of $285.58 million. BE Semiconductor Industries had a return on equity of 46.44% and a net margin of 28.42%. On average, sell-side analysts predict that BE Semiconductor Industries NV will post 4.83 earnings per share for the current fiscal year.
About BE Semiconductor Industries
BE Semiconductor Industries N.V. (Besi) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to assemble, package, and finish semiconductor devices after wafer fabrication.
Besi’s product portfolio includes die-attach equipment, packaging systems, molding and singulation equipment, plating systems, and related solutions for advanced semiconductor packaging. Its technologies support applications such as flip-chip, wafer-level packaging, thermo-compression bonding, and hybrid bonding, which are used in electronics, communications, automotive, computing, and other semiconductor markets.
Founded in 1995 and headquartered in Duiven, the Netherlands, Besi serves semiconductor manufacturers and assembly and test providers worldwide.
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