Disco Corp (OTCMKTS:DSCSY – Get Free Report) was the target of a significant growth in short interest in August. As of August 31st, there was short interest totaling 46,196 shares, a growth of 203.0% from the August 15th total of 15,246 shares. Approximately 0.0% of the company’s stock are short sold. Based on an average daily volume of 311,923 shares, the short-interest ratio is presently 0.1 days.
Hedge Funds Weigh In On Disco
An institutional investor recently bought a new stake in Disco stock. Azimuth Capital Investment Management LLC purchased a new stake in shares of Disco Corp (OTCMKTS:DSCSY – Free Report) during the 2nd quarter, according to the company in its most recent disclosure with the Securities and Exchange Commission (SEC). The institutional investor purchased 237,250 shares of the company’s stock, valued at approximately $11,862,000. 0.03% of the stock is currently owned by institutional investors.
Disco Price Performance
Disco stock opened at $34.34 on Monday. The company’s fifty day moving average price is $38.67 and its two-hundred day moving average price is $42.95. Disco has a one year low of $26.33 and a one year high of $58.00. The company has a market capitalization of $37.26 billion, a price-to-earnings ratio of 39.47 and a beta of 1.54.
Analyst Ratings Changes
Several equities analysts have recently commented on DSCSY shares. Jefferies Financial Group raised Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. Zacks Research lowered shares of Disco from a “strong-buy” rating to a “hold” rating in a research note on Tuesday, May 19th. One investment analyst has rated the stock with a Buy rating and one has given a Hold rating to the stock. According to MarketBeat.com, the company currently has a consensus rating of “Moderate Buy”.
Check Out Our Latest Stock Analysis on Disco
About Disco
DISCO Corporation, traded in the United States under the symbol DSCSY, is a Japanese manufacturer of precision processing equipment and tools used primarily in semiconductor and electronic-component production. The company develops technologies for cutting, grinding and polishing hard, brittle materials such as silicon, compound semiconductors, glass and ceramics.
Its product portfolio includes wafer-dicing saws, grinding and polishing systems, laser-based processing equipment, and the consumable blades, wheels and other tools used with those machines.
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