SEI High Yield Bond & Alternative Credit ETF Announces Dividend of $0.12 (NASDAQ:LEND)

SEI High Yield Bond & Alternative Credit ETF (NASDAQ:LEND – Get Free Report) announced a dividend on Wednesday, September 2nd. Investors of record on Thursday, September 3rd will be given a dividend of 0.1206 per share on Friday, September 4th. The ex-dividend date of this dividend is Thursday, September 3rd.

SEI High Yield Bond & Alternative Credit ETF Price Performance

Shares of NASDAQ:LEND opened at $24.88 on Thursday. The business’s 50 day moving average is $24.98 and its 200-day moving average is $21.09. SEI High Yield Bond & Alternative Credit ETF has a 1-year low of $24.79 and a 1-year high of $25.29.

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