Kulicke and Soffa Industries (NASDAQ:KLIC – Get Free Report) was upgraded by analysts at Zacks Research from a “hold” rating to a “strong-buy” rating in a research note issued to investors on Tuesday,Zacks.com reports.
A number of other research firms also recently weighed in on KLIC. Weiss Ratings reiterated a “hold (c)” rating on shares of Kulicke and Soffa Industries in a research report on Friday, August 7th. Needham & Company LLC raised their price objective on Kulicke and Soffa Industries from $105.00 to $115.00 and gave the stock a “buy” rating in a research note on Thursday, August 6th. One analyst has rated the stock with a Strong Buy rating, two have assigned a Buy rating and two have issued a Hold rating to the company’s stock. According to data from MarketBeat, Kulicke and Soffa Industries has a consensus rating of “Moderate Buy” and an average price target of $69.67.
Check Out Our Latest Stock Analysis on Kulicke and Soffa Industries
Kulicke and Soffa Industries Price Performance
Kulicke and Soffa Industries (NASDAQ:KLIC – Get Free Report) last announced its earnings results on Wednesday, August 5th. The semiconductor company reported $1.20 earnings per share (EPS) for the quarter, beating analysts’ consensus estimates of $1.06 by $0.14. Kulicke and Soffa Industries had a net margin of 12.18% and a return on equity of 14.39%. The company had revenue of $330.41 million during the quarter, compared to analysts’ expectations of $308.50 million. During the same quarter in the previous year, the business posted $0.07 earnings per share. Kulicke and Soffa Industries’s quarterly revenue was up 122.6% on a year-over-year basis. Kulicke and Soffa Industries has set its Q4 2026 guidance at 1.278-1.562 EPS. On average, equities analysts anticipate that Kulicke and Soffa Industries will post 3.14 earnings per share for the current fiscal year.
Insider Activity
In other Kulicke and Soffa Industries news, CEO Lester A. Wong sold 60,000 shares of the business’s stock in a transaction that occurred on Thursday, June 18th. The shares were sold at an average price of $121.71, for a total transaction of $7,302,600.00. Following the completion of the transaction, the chief executive officer directly owned 50,743 shares in the company, valued at $6,175,930.53. The trade was a 54.18% decrease in their ownership of the stock. The sale was disclosed in a document filed with the Securities & Exchange Commission, which is available at this link. Also, Director Peter T. M. Kong sold 1,551 shares of the company’s stock in a transaction on Thursday, June 11th. The stock was sold at an average price of $110.00, for a total value of $170,610.00. Following the sale, the director owned 100,009 shares of the company’s stock, valued at $11,000,990. The trade was a 1.53% decrease in their ownership of the stock. The disclosure for this sale is available in the SEC filing. In the last 90 days, insiders sold 96,551 shares of company stock worth $11,179,010. Insiders own 1.20% of the company’s stock.
Hedge Funds Weigh In On Kulicke and Soffa Industries
Several hedge funds and other institutional investors have recently modified their holdings of KLIC. Mitsubishi UFJ Asset Management Co. Ltd. bought a new stake in shares of Kulicke and Soffa Industries during the 2nd quarter worth $28,000. Kilter Group LLC acquired a new stake in Kulicke and Soffa Industries in the second quarter valued at about $42,000. Summit Securities Group LLC bought a new position in Kulicke and Soffa Industries in the first quarter valued at about $26,000. Meeder Asset Management Inc. bought a new position in Kulicke and Soffa Industries in the fourth quarter valued at about $30,000. Finally, USA Financial Formulas acquired a new position in Kulicke and Soffa Industries during the first quarter worth about $44,000. Institutional investors own 98.22% of the company’s stock.
About Kulicke and Soffa Industries
Kulicke & Soffa Industries (NASDAQ:KLIC) is a global supplier of semiconductor and LED assembly equipment. The company specializes in the design, development and manufacture of advanced die bonding, wire bonding, flip-chip bumping and wafer-level packaging systems. Its solutions support a wide range of applications in consumer electronics, automotive, communications and other high-growth segments within the semiconductor and LED industries.
Key products include precision wire bonders for microelectronic packaging, die attach systems for chip placement, flip-chip bonders for advanced packaging architectures and LED packaging platforms that enable high-volume production of automotive and general-illumination LEDs.
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