BE Semiconductor Industries (OTCMKTS:BESIY) Trading Down 8% After Earnings Miss

Posted by George Bondi on Jul 23rd, 2026

BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s share price traded down 8% on Thursday after the company announced weaker than expected quarterly earnings. The stock traded as low as $261.00 and last traded at $261.00. Approximately 1,664 shares traded hands during mid-day trading, a decline of 79% from the average session volume of 7,745 shares. The stock had previously closed at $283.80.

The technology company reported $1.29 earnings per share (EPS) for the quarter, missing analysts’ consensus estimates of $1.30 by ($0.01). BE Semiconductor Industries had a return on equity of 38.42% and a net margin of 24.02%.

Wall Street Analyst Weigh In

A number of research analysts recently issued reports on BESIY shares. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. Deutsche Bank Aktiengesellschaft reiterated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Finally, Zacks Research cut BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research note on Friday, June 26th. Five research analysts have rated the stock with a Buy rating and four have assigned a Hold rating to the company’s stock. According to MarketBeat, the company has a consensus rating of “Moderate Buy”.

View Our Latest Report on BESIY

BE Semiconductor Industries Trading Down 8.0%

The company has a market capitalization of $18.93 billion, a P/E ratio of 118.10 and a beta of 1.97. The stock’s 50 day moving average is $316.28 and its 200-day moving average is $257.29. The company has a debt-to-equity ratio of 1.11, a current ratio of 4.74 and a quick ratio of 4.17.

BE Semiconductor Industries Company Profile

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.