Disco (OTCMKTS:DSCSY) Trading Down 7.9% – Should You Sell?

Shares of Disco Corp (OTCMKTS:DSCSYGet Free Report) dropped 7.9% on Tuesday . The stock traded as low as $45.22 and last traded at $45.55. Approximately 9,638 shares traded hands during mid-day trading, a decline of 97% from the average daily volume of 299,724 shares. The stock had previously closed at $49.45.

Analyst Upgrades and Downgrades

Separately, Zacks Research upgraded Disco from a “hold” rating to a “strong-buy” rating in a research report on Monday, April 20th. Two analysts have rated the stock with a Strong Buy rating, Based on data from MarketBeat.com, the stock currently has a consensus rating of “Strong Buy”.

Read Our Latest Report on Disco

Disco Trading Down 3.8%

The stock has a market capitalization of $48.57 billion, a P/E ratio of 54.60 and a beta of 1.63. The company has a fifty day simple moving average of $44.30 and a two-hundred day simple moving average of $39.18.

Disco (OTCMKTS:DSCSYGet Free Report) last issued its earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share (EPS) for the quarter. Disco had a net margin of 30.95% and a return on equity of 26.03%. The company had revenue of $848.13 million for the quarter, compared to analyst estimates of $771.53 million. As a group, analysts forecast that Disco Corp will post 1.07 earnings per share for the current fiscal year.

About Disco

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

Further Reading

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