BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) saw a large increase in short interest during the month of October. As of October 15th, there was short interest totaling 2,511 shares, an increase of 423.1% from the September 30th total of 480 shares. Approximately 0.0% of the shares of the company are sold short. Based on an average daily trading volume, of 25,823 shares, the days-to-cover ratio is presently 0.1 days.
BE Semiconductor Industries Stock Performance
Shares of OTCMKTS BESIY opened at $182.00 on Thursday. The company has a debt-to-equity ratio of 0.60, a current ratio of 4.28 and a quick ratio of 3.73. The stock’s fifty day moving average price is $209.60 and its two-hundred day moving average price is $246.29. BE Semiconductor Industries has a one year low of $140.07 and a one year high of $374.33. The firm has a market cap of $13.20 billion, a price-to-earnings ratio of 43.33 and a beta of 1.99.
Analysts Set New Price Targets
BESIY has been the subject of several research analyst reports. Berenberg Bank raised shares of BE Semiconductor Industries from a “hold” rating to a “strong-buy” rating in a report on Tuesday, August 4th. UBS Group cut shares of BE Semiconductor Industries from a “buy” rating to a “sell” rating in a report on Wednesday, October 7th. Zacks Research downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, September 25th. Finally, Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, September 8th. One analyst has rated the stock with a Strong Buy rating, four have given a Buy rating, three have given a Hold rating and one has given a Sell rating to the company. Based on data from MarketBeat.com, the stock has an average rating of “Moderate Buy”.
Get Our Latest Report on BE Semiconductor Industries
About BE Semiconductor Industries
BE Semiconductor Industries N.V. (BESI) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to package semiconductor devices after wafer fabrication, helping customers assemble, connect, protect and test chips for use in electronic products.
BESI’s product portfolio includes die-attach equipment, packaging systems, molding equipment and singulation systems. Its technologies support applications such as advanced semiconductor packaging, flip-chip assembly, thermo-compression bonding and hybrid bonding, which are used in products requiring higher performance, smaller dimensions and improved power efficiency.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI serves semiconductor manufacturers and assembly and test providers worldwide.
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