Lam Research Corporation (NASDAQ:LRCX) Announces Dividend Increase – $0.33 Per Share

Posted by Geri Gentry on Aug 28th, 2026

Lam Research Corporation (NASDAQ:LRCX – Get Free Report) announced a quarterly dividend on Thursday, August 27th. Investors of record on Wednesday, September 23rd will be paid a dividend of 0.33 per share by the semiconductor company on Wednesday, October 14th. This represents a c) annualized dividend and a yield of 0.4%. The ex-dividend date is Wednesday, September 23rd. This is a 26.9% increase from Lam Research’s previous quarterly dividend of $0.26.

Lam Research has increased its dividend payment by an average of 0.1%per year over the last three years and has increased its dividend annually for the last 10 consecutive years. Lam Research has a payout ratio of 25.9% meaning its dividend is sufficiently covered by earnings. Equities analysts expect Lam Research to earn $11.35 per share next year, which means the company should continue to be able to cover its $1.04 annual dividend with an expected future payout ratio of 9.2%.

Lam Research Stock Up 1.8%

NASDAQ LRCX opened at $318.58 on Friday. The stock’s 50 day moving average is $332.17 and its 200 day moving average is $289.05. The company has a current ratio of 2.63, a quick ratio of 1.91 and a debt-to-equity ratio of 0.30. Lam Research has a 12 month low of $94.11 and a 12 month high of $438.50. The stock has a market cap of $398.65 billion, a PE ratio of 55.31, a P/E/G ratio of 1.24 and a beta of 1.84.

Lam Research (NASDAQ:LRCX – Get Free Report) last posted its quarterly earnings results on Wednesday, July 29th. The semiconductor company reported $1.82 earnings per share for the quarter, topping the consensus estimate of $1.69 by $0.13. Lam Research had a return on equity of 67.60% and a net margin of 31.27%.The business had revenue of $6.72 billion during the quarter, compared to the consensus estimate of $6.66 billion. During the same period in the prior year, the company posted $1.33 EPS. The firm’s revenue for the quarter was up 30.0% compared to the same quarter last year. Lam Research has set its Q1 2027 guidance at 2.000-2.300 EPS. Research analysts predict that Lam Research will post 9.32 EPS for the current fiscal year.

Analyst Upgrades and Downgrades

A number of equities analysts recently weighed in on LRCX shares. Morgan Stanley dropped their target price on shares of Lam Research from $404.00 to $367.00 and set an “overweight” rating for the company in a research report on Thursday, July 30th. TD Cowen reiterated a “buy” rating and issued a $400.00 price target (up from $340.00) on shares of Lam Research in a report on Thursday, July 9th. Evercore reiterated an “outperform” rating and issued a $355.00 price target on shares of Lam Research in a research note on Monday, July 20th. Jefferies Financial Group set a $335.00 price objective on Lam Research and gave the company a “buy” rating in a research report on Thursday, July 30th. Finally, Needham & Company LLC reiterated a “buy” rating and issued a $390.00 target price on shares of Lam Research in a research report on Thursday, July 30th. One research analyst has rated the stock with a Strong Buy rating, twenty-six have assigned a Buy rating and five have assigned a Hold rating to the company. Based on data from MarketBeat, the company presently has a consensus rating of “Moderate Buy” and an average price target of $357.31.

Check Out Our Latest Stock Report on Lam Research

Lam Research Company Profile

(Get Free Report)

Lam Research Corporation (NASDAQ: LRCX) is a global supplier of wafer fabrication equipment and services to the semiconductor industry. Founded in 1980 by David K. Lam and headquartered in Fremont, California, the company develops and manufactures systems used in multiple stages of semiconductor device production, including thin film deposition, plasma etch, wafer cleaning and related process modules and automation.

Lam’s product portfolio covers core process technologies employed by logic and memory manufacturers, with equipment designed to support advanced-node patterning, 3D NAND and other emerging device architectures.