Disco Corp (OTCMKTS:DSCSY) Sees Significant Increase in Short Interest

Disco Corp (OTCMKTS:DSCSYGet Free Report) saw a significant growth in short interest in July. As of July 31st, there was short interest totaling 22,522 shares, a growth of 112.5% from the July 15th total of 10,600 shares. Based on an average daily trading volume, of 886,482 shares, the short-interest ratio is currently 0.0 days. Currently, 0.0% of the shares of the company are short sold.

Wall Street Analysts Forecast Growth

Several equities research analysts have recently issued reports on the stock. Jefferies Financial Group raised shares of Disco from a “hold” rating to a “buy” rating in a research note on Monday, July 27th. Zacks Research cut Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the stock. According to MarketBeat, the company currently has a consensus rating of “Moderate Buy”.

View Our Latest Analysis on DSCSY

Disco Stock Down 2.7%

Disco stock opened at $40.71 on Friday. Disco has a 52-week low of $24.94 and a 52-week high of $58.00. The firm has a market capitalization of $44.16 billion, a price-to-earnings ratio of 46.79 and a beta of 1.55. The company has a fifty day simple moving average of $43.91 and a 200-day simple moving average of $44.29.

Disco (OTCMKTS:DSCSYGet Free Report) last posted its quarterly earnings results on Thursday, July 23rd. The company reported $0.20 earnings per share for the quarter. The firm had revenue of $717.28 million for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. On average, research analysts anticipate that Disco will post 1.05 EPS for the current fiscal year.

About Disco

(Get Free Report)

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

Further Reading

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