BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) shares saw unusually-strong trading volume on Monday . 12,386 shares changed hands during trading, an increase of 63% from the previous session’s volume of 7,592 shares.The stock last traded at $255.56 and had previously closed at $258.33.
Analysts Set New Price Targets
A number of equities research analysts have commented on the stock. Zacks Research cut shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, June 26th. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th. Finally, Deutsche Bank Aktiengesellschaft reaffirmed a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Five equities research analysts have rated the stock with a Buy rating and four have given a Hold rating to the company’s stock. According to data from MarketBeat.com, the stock currently has an average rating of “Moderate Buy”.
Get Our Latest Stock Report on BE Semiconductor Industries
BE Semiconductor Industries Stock Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last issued its quarterly earnings data on Thursday, April 23rd. The technology company reported $0.76 earnings per share (EPS) for the quarter, meeting analysts’ consensus estimates of $0.76. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. The firm had revenue of $216.51 million during the quarter, compared to analysts’ expectations of $220.77 million. On average, analysts forecast that BE Semiconductor Industries NV will post 4.45 earnings per share for the current year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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