BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report)’s stock price gapped down prior to trading on Monday . The stock had previously closed at $293.34, but opened at $279.98. BE Semiconductor Industries shares last traded at $280.8820, with a volume of 1,675 shares changing hands.
Wall Street Analyst Weigh In
BESIY has been the subject of a number of recent research reports. Morgan Stanley reiterated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, May 19th. Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of BE Semiconductor Industries in a research note on Friday, May 15th. Finally, Zacks Research lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, June 26th. Five investment analysts have rated the stock with a Buy rating and four have assigned a Hold rating to the company’s stock. Based on data from MarketBeat, the stock presently has a consensus rating of “Moderate Buy”.
Read Our Latest Stock Analysis on BE Semiconductor Industries
BE Semiconductor Industries Price Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last released its quarterly earnings data on Thursday, April 23rd. The technology company reported $0.76 earnings per share for the quarter, meeting analysts’ consensus estimates of $0.76. BE Semiconductor Industries had a net margin of 24.02% and a return on equity of 38.42%. The company had revenue of $216.51 million during the quarter, compared to analysts’ expectations of $220.77 million. As a group, equities analysts predict that BE Semiconductor Industries NV will post 4.45 earnings per share for the current fiscal year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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