BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) shares reached a new 52-week high during trading on Thursday . The stock traded as high as $315.00 and last traded at $314.78, with a volume of 670 shares changing hands. The stock had previously closed at $308.3101.
Analyst Ratings Changes
BESIY has been the topic of several analyst reports. Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research report on Tuesday. Zacks Research upgraded BE Semiconductor Industries to a “strong-buy” rating in a research report on Thursday, April 23rd. Berenberg Bank upgraded BE Semiconductor Industries to a “hold” rating in a research report on Monday, February 23rd. Finally, Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. One equities research analyst has rated the stock with a Strong Buy rating, five have issued a Buy rating and four have assigned a Hold rating to the company’s stock. Based on data from MarketBeat.com, the company presently has a consensus rating of “Moderate Buy”.
View Our Latest Analysis on BESIY
BE Semiconductor Industries Trading Up 1.8%
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last released its quarterly earnings data on Thursday, April 23rd. The technology company reported $0.76 earnings per share for the quarter, hitting the consensus estimate of $0.76. The business had revenue of $216.51 million during the quarter, compared to analyst estimates of $220.77 million. BE Semiconductor Industries had a return on equity of 40.69% and a net margin of 24.02%. On average, equities research analysts expect that BE Semiconductor Industries NV will post 4.46 EPS for the current fiscal year.
About BE Semiconductor Industries
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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