ChipMOS Technologies Inc – (NASDAQ:IMOS) announced an annual dividend on Thursday, August 9th, NASDAQ reports. Shareholders of record on Friday, October 19th will be paid a dividend of 0.135 per share by the semiconductor company on Friday, October 19th. This represents a yield of 0.88%. The ex-dividend date of this dividend is Thursday, October 18th.
ChipMOS Technologies has raised its dividend by an average of 4.0% per year over the last three years.
Shares of IMOS opened at $15.10 on Friday. The company has a debt-to-equity ratio of 0.41, a current ratio of 2.48 and a quick ratio of 2.06. The stock has a market capitalization of $656.05 million, a PE ratio of 15.89 and a beta of 0.48. ChipMOS Technologies has a one year low of $12.69 and a one year high of $21.64.
ChipMOS Technologies (NASDAQ:IMOS) last issued its earnings results on Thursday, August 9th. The semiconductor company reported $0.10 EPS for the quarter, missing the Thomson Reuters’ consensus estimate of $0.17 by ($0.07). The firm had revenue of $147.60 million during the quarter, compared to analyst estimates of $145.24 million. ChipMOS Technologies had a net margin of 2.71% and a return on equity of 2.91%. The business’s quarterly revenue was down 1.1% on a year-over-year basis. During the same quarter in the prior year, the business earned $0.25 earnings per share.
Several analysts have recently commented on the company. BidaskClub upgraded ChipMOS Technologies from a “strong sell” rating to a “sell” rating in a research note on Wednesday, August 8th. ValuEngine upgraded ChipMOS Technologies from a “sell” rating to a “hold” rating in a research note on Thursday, July 12th.
ChipMOS Technologies Company Profile
ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision integrated circuits, and related assembly and testing services. It provides a range of back-end assembly and test services, including engineering test, wafer probing and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other flat-panel display driver semiconductors.
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